03228 景旺電子
KINWONG
KINWONG
| Register Close | 2026/09/24 IPO Closing in 3 Days |
| Listing Date | 2026/09/29 |
|
|
|
|
|
|
|
|
|
|
IPO Detail
COMPANY PROFILE
Shenzhen Kinwong Electronic Co., Ltd. is a globally recognized printed circuit board manufacturer driven by technological development and distinguished by a comprehensive broad product offerings. The Group's products provide connectivity infrastructure for global customers in the fields of automotive electronics, telecommunication and data infrastructure, smart devices, industrial control, and other sectors.
--
According to CIC, the Group is the world’s largest automotive electronics PCB provider with a market share of 10.6%, and rank eleventh among all PCB providers worldwide with a market share of 2.5% in terms of revenue in 2025.
--
The Group has established long-standing business relationships with leading enterprises across multiple industries, including automotive electronics, smart devices, industrial control and medical devices, as well as telecommunication and data infrastructure. Its PCB products have been broadly applied in the automotive products of all of the top ten global automotive groups.
--
The Group's sales model is based on direct sales, as supplemented by sales to trading partners to effectively reach and serve a diverse range of customers.
BASIC INFORMATION
| Market | Hong Kong (Main Board) |
| Business Nature | Industrials |
| Major Business Area | Global |
| Board Lot | 100 |
GLOBAL OFFERING
| No. of Offer Shares | 72.94M H shares |
| No. of International Offer Shares | 65.65M H shares |
| No. of HK Offer Shares | 7.29M H shares |
| Offer Price | $69.88 |
| Stock Code | 3228 |
| Sponsor(s) | CITIC Securities (Hong Kong) Limited, Merrill Lynch (Asia Pacific) Limited, Guolian Securities International Capital Co., Limited |
| Underwriter(s) | CLSA Limited, Merrill Lynch (Asia Pacific) Limited, Guolian Securities International Capital Co., Limited |
TIME TABLE
| Application Period | Sep 21 (Mon) - noon, Sep 24 (Thu) |
| Price Determination Date | Sep 25 (Fri) |
| Result Announcement Date | On or before Sep 28 (Mon) |
| Result Announcement Date | On or before Sep 28 (Mon) |
| Result Announcement Date | On or before Sep 29 (Tue) |
| Dealings in Shares commence on | Sep 29, 2026. (Tue) |
Reallocation of Shares Offered
Sales Statistics (HKD)
| Offer Price | $69.88 |
| Capitalization (H Shares) | 5.10B |
| NAV / share ($) | $18.8 (Unaudited pro forma adj NAV / share) |
Use Of Proceeds
| Assuming the offer price being at HKD 69.88, the net proceeds raised would be HKD 4.96B, of which |
| 60% : Expand and upgrade production capacity for high value-added products |
| 15% : Strengthen research and development and technology reserves in next-generation electronic information technologies |
| 15% : Repay a portion of existing interest-bearing bank borrowings |
| 10% : Working capital |
Related Document
| Prospectus |  Chinese Version | English Version |
| Remark： | The above information is referenced from the prospectus. |
| All data is calculated from the non- exercise rights(if applicable). |
Name︰
--
--
--
Subscription --
Result Announcement --
Listing --Offer Price︰--
| Currency | : |
| Listing Price | : |
| Board Lot | : |
| Admission Fee* |
: |
| Subscribing Lot | : |
| Subscribing Fee | : |
| Subscribing Amount | : |
*Admission fees include brokerage of 1%, SFC transaction levy of 0.0027%, Stock Exchange trading fee of 0.005% and FRC transaction levy of 0.00015% (i.e. 1.0077% in total).